Engineer, Process (Die Prep)

Location

Singapore, Singapore, Singapore

Salary

Not specified

Company

Akash pawar

Job description

• Role & Company / Project Overview Agensi Pekerjaan Inter Island Sdn Bhd is hiring a Process Engineer specializing in Die Prep for a semiconductor manufacturing setup in Singapore. • Key Responsibilities & Daily Duties - Lead process engineering activities across Die Prep operations, including wafer saw, dicing, and die attach processes. - Drive yield improvement initiatives, reduce scrap, and optimize cycle times. - Conduct root cause failure analysis (RCFA) for process defects and establish corrective/preventive measures. - Qualify new materials, process recipes, and equipment upgrades in collaboration with equipment and quality teams. - Prepare and maintain standard operating procedures (SOPs) and process flow documentation. • Required Qualifications, Skills & Experience - Bachelor’s Degree or Master’s in Electrical/Electronic Engineering, Chemical Engineering, Materials Science, Physics, or equivalent. - Proven engineering track record within semiconductor fab or assembly environments focusing on Die Prep processes. - Strong expertise in statistical process control (SPC), design of experiments (DOE), and continuous yield improvement. • Working Hours, Shifts & Location Details - Location: Singapore. - Onsite semiconductor cleanroom facility. • Application Instructions - Share updated CV; only shortlisted candidates will be notified.